Apple likely to be the first to use TSMC’s 3nm chip process: Report

San Francisco, Aug 19 (IANS) Tech large Apple’s 2022 MacE-book Pros could pack new M2 Pro and M2 Max chipsets made with TSMC’s newest 3nm manufacturing course of, media stories say.

According to the Commercial Times, TSMC, the world’s largest semiconductor contract producer, has been steadily constructing out its 3nm manufacturing processes and Apple might be the first buyer to get its palms on these chips.

The report notes that Apple will use 3nm wafers for the first time in the second half of 2022, likely for its M2 Pro chipsets, citing media stories, AppleInsider reported.

Future releases constructed on the 3nm course of might embrace the iPhone-specific A17 chipset, in addition to a future third-generation of the M sequence.

Commercial Times additionally reported that TSMC will start mass manufacturing of its 3nm wafers in September.

The report added that the preliminary yield will be increased than when TSMC switched to 5nm processes.

Compared to earlier chipmaking processes, semiconductors made utilizing the 3nm course of might carry elevated energy effectivity and efficiency to Apple’s gadgets.

Prior stories point out that Apple will use the M2 Pro chip — and presumably an M2 Max — in its 14-inch MacE-book Pro, 16-inch MacE-book Pro, and Mac mini fashions later in 2022 or early 2023.

(Except for the headline, the remainder of this IANS article is un-edited)

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